• Bonding Machine for Multilayer Press Process
  • Bonding Machine for Multilayer Press Process
  • Bonding Machine for Multilayer Press Process
  • Bonding Machine for Multilayer Press Process
  • Bonding Machine for Multilayer Press Process
  • Bonding Machine for Multilayer Press Process

Bonding Machine for Multilayer Press Process

Automatic Grade: Automatic
Application: Machinery & Hardware
Driven Type: Electric
Samples:
US$ 680000/Piece 1 Piece(Min.Order)
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Customization:
Shipping Cost:

Estimated freight per unit.

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Payment Method: visa mastercard discover JCB diners club american express T/T
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Currency: US$
Return&refunds: You can apply for a refund up to 30 days after receipt of the products.
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Bonding Machine for Multilayer Press Process pictures & photos
Bonding Machine for Multilayer Press Process
US $67,000 / set
Min. Order: 1 set
Gold Member Since 2020

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Secured Trading Service
Manufacturer/Factory

Basic Info.

Model NO.
RAY-RY8-E2
After-Sales Service
1 Year
Warranty
1 Year
Gluing Mode
Bonding
Packaging Material
Prepreg and Metal Core
Packaging
Wooden Case
Transport Package
by Sea
Trademark
RAY SHINE
Origin
China
HS Code
8419899090
Production Capacity
100set/Year

Packaging & Delivery

Package Size
230.00cm * 150.00cm * 180.00cm
Package Gross Weight
1300.000kg

Product Description

working dimension 623mm* 762mm
Fusion effective size Min 350mm*350mm   Max  623mm*762mm
Fusion plate thickness range 0.2mm≤t≤12.0mm
Core plate thickness range 0.05mm~1.0mm
Range of fusion layers 60
The inner core plate is copper thick 1/3oz~3oz


Description:
Ray-RY series are mainly used in PCB industry before and during hot pressing engineering. In order to prevent product dislocation, the inner layer board and semi-solidified bonding; The electric melting head heats the set fusion zone of the product, so that the multilayer product and PP sheet are glued together.

Bonding Machine for Multilayer Press Process
Heating principle of fusion head:
The fusion head is  high frequency generator assembly, and the high frequency coil is installed inside. When the power is energized, the high frequency pulse generates high frequency alternating magnetic field, and the heating copper block generates induced current and heats up. Due to the design of heating plate in each layer of products, the heating uniformity is very good, so it can effectively fuse the inner layer plate and PP.
Bonding Machine for Multilayer Press Process
Company Introduction
Ray-Shine Electronic (HK) Ltd (Dongguan Dinglu Electronic Tech Co.,Ltd)is a high&new-tech enterprise located in Dongguan city, Guangdong Province China. We expertised in PCB production and percision inspection machine equipment such as prepreg cutting machine, metallographic machines, line width testing machine, panel thickness testing machine, X-ray inspection machine ect, and PCB related consumables such as PP sheet, filter cartridge, protective film  researching, manufacturing, and selling and technology support.

Bonding Machine for Multilayer Press Process





 
Bonding Machine for Multilayer Press Process
Bonding Machine for Multilayer Press Process
FAQ:

1. What's the usage ?

----It's used for multilayer PCB.


2.How about the lead time?

----Normally 30-45 days after payment receiving.


Packing and Shipping

Packing Method:
Standard wooden package

Shipping Way:
1. By air, for sample and small package,international express like DHL, UPS, EMS...
2. By sea, for large package and quantity;
3. Other ways as customer requested. 


 

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From payment to delivery, we protect your trading.
Bonding Machine for Multilayer Press Process pictures & photos
Bonding Machine for Multilayer Press Process
US $67,000 / set
Min. Order: 1 set
Gold Member Since 2020

Suppliers with verified business licenses

Secured Trading Service
Manufacturer/Factory
Plant Area
2050 square meters
International Commercial Terms(Incoterms)
FOB, CIF, CFR